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Analysis and Design of Structural Bonded Joints Analysis and Design of Structural Bonded Joints by Liyong Tong,Grant P. Steven

Analysis and Design of Structural Bonded Joints

by Liyong Tong,Grant P. Steven


ISBN 13: 9780792384946

Format: Hardcover (304 pages)
Publisher: Springer
Published: 30 Apr 1999

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Lock-in Thermography: Basics and Use for Evaluating Electronic Devices and Materials (Springer Series in Advanced Microelectronics) Lock-in Thermography: Basics and Use for Evaluating Electronic Devices and Materials (Springer Series in Advanced Microelectronics) by Otwin Breitenstein,Wilhelm Warta,Martin Langenkamp

Lock-in Thermography: Basics and Use for Evaluating Electronic Devices and Materials (Springer Series in Advanced Microelectronics)

by Otwin Breitenstein,Wilhelm Warta,Martin Langenkamp


ISBN 13: 9783642024160

Format: Hardcover (255 pages)
Publisher: Springer
Published: 05 Sep 2010

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Low Speed Wind Tunnel Testing Low Speed Wind Tunnel Testing by Jewel B. Barlow,William H. Rae,Alan Pope

Low Speed Wind Tunnel Testing

by Jewel B. Barlow,William H. Rae,Alan Pope


ISBN 13: 9780471557746

Format: Hardcover (728 pages)
Publisher: John Wiley & Sons
Published: 03 Mar 1999

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Structural Integrity Monitoring Structural Integrity Monitoring by R.A. Collacott

Structural Integrity Monitoring

by R.A. Collacott


ISBN 13: 9780412219207

Format: Hardcover (474 pages)
Publisher: Springer
Published: 30 Nov 1985

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New : $158.79  
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Ultrasonic Nondestructive Evaluation Systems: Models and Measurements Ultrasonic Nondestructive Evaluation Systems: Models and Measurements by Lester Schmerr,Jung-Sin Song

Ultrasonic Nondestructive Evaluation Systems: Models and Measurements

by Lester Schmerr,Jung-Sin Song


ISBN 13: 9780387490618

Format: Hardcover (550 pages)
Publisher: Springer
Published: 11 Jun 2007

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Dynamic Failure of Materials and Structures Dynamic Failure of Materials and Structures by Shukla

Dynamic Failure of Materials and Structures

by Shukla


ISBN 13: 9781441904454

Format: Hardcover (424 pages)
Publisher: Springer
Published: 06 Nov 2009

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