Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method
by Sheng-Jye Hwang,Yeong-Jyh Lin
ISBN 13: 9783639000344
Format: Paperback (136 pages) Publisher: VDM Verlag Dr. Muller Aktiengesellschaft & Co. KG Published: 22 Apr 2008
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