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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging: Technology Drivers Pt. 1

by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein

ISBN 13: 9780412084317

Format: Hardcover (752 pages)
Publisher: Springer
Published: 31 Jan 1997

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