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Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method by Sheng-Jye Hwang,Yeong-Jyh Lin

Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method

by Sheng-Jye Hwang,Yeong-Jyh Lin


ISBN 13: 9783639000344

Format: Paperback (136 pages)
Publisher: VDM Verlag Dr. Muller Aktiengesellschaft & Co. KG
Published: 22 Apr 2008

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Distributed Autonomous Robotic System 6: v. 6 Distributed Autonomous Robotic System 6: v. 6 by

Distributed Autonomous Robotic System 6: v. 6

by


ISBN 13: 9784431358695

Format: Hardcover (484 pages)
Publisher: Springer
Published: 17 Jul 2007

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A Guide to Lead-free Solders: Physical Metallurgy and Reliability A Guide to Lead-free Solders: Physical Metallurgy and Reliability by John W. Evans

A Guide to Lead-free Solders: Physical Metallurgy and Reliability

by John W. Evans


ISBN 13: 9781846283093

Format: Hardcover (206 pages)
Publisher: Springer
Published: 12 Dec 2006

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