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Post-oil Energy Technology

by Bela G. Liptak

ISBN 13: 9781420070255

Format: Hardcover (536 pages)
Publisher: CRC Press
Published: 22 Dec 2008

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Quantum Mechanics

by B.H. Bransden

ISBN 13: 9780582356917

Format: Paperback (820 pages)
Publisher: Pearson
Published: 28 Jan 2000

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Thermal Imaging Cameras

by Thomas Williams

ISBN 13: 9781420071856

Format: Hardcover (238 pages)
Publisher: Taylor & Francis
Published: 01 Apr 2009

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OFDM for Optical Communications

by N/A

ISBN 13: 9780123748799

Format: Hardcover (456 pages)
Publisher: Academic Press
Published: 07 Dec 2009

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Audel Electrician's Pocket Manual (Audel Technical Trades Series)

by N/A

ISBN 13: 9780764541995

Format: Paperback (368 pages)
Publisher: John Wiley & Sons
Published: 10 Oct 2003

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Thin-Film Deposition: Principles and Practice

by N/A

ISBN 13: 9780070585027

Format: Hardcover (616 pages)
Publisher: McGraw-Hill Professional
Published: 01 Apr 1995

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Real–Time Stability Assessment in Modern Power System Control Centers: 42 (IEEE Press Series on Power and Energy Systems)

by S. C. Savulescu

ISBN 13: 9780470233306

Format: Illustrated (425 pages)
Publisher: Wiley-IEEE Press
Published: 06 Mar 2009

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Solar Energy Fundamentals and Modeling Techniques: Atmosphere, Environment, Climate Change and Renewable Energy

by Sen

ISBN 13: 9781848001336

Format: Hardcover (292 pages)
Publisher: Springer
Published: 14 Apr 2008

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Practical Audio Amplifier Circuit Projects

by Andrew Singmin

ISBN 13: 9780750671491

Format: Paperback (160 pages)
Publisher: Newnes
Published: 29 Sep 1999

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Tribology of Elec Contacts (Electrical and Computer Engineering)

by Milenko Braunovic,Nikolai K. Myshkin,Valery V. Konchits

ISBN 13: 9781574447279

Format: Hardcover (672 pages)
Publisher: CRC Press
Published: 15 Dec 2006

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Power Definitions and the Physical Mechanism of Power Flow (Wiley - IEE)

by Alexander Eigeles Emanuel

ISBN 13: 9780470660744

Format: Hardcover (280 pages)
Publisher: Wiley-Blackwell
Published: 20 Aug 2010

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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging: Technology Drivers Pt. 1

by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein

ISBN 13: 9780412084317

Format: Hardcover (752 pages)
Publisher: Springer
Published: 31 Jan 1997

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