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Delay Fault Testing for VLSI Circuits (Frontiers in Electronic Testing) Delay Fault Testing for VLSI Circuits (Frontiers in Electronic Testing) by Angela Krstic,Kwang-Ting (Tim) Cheng

Delay Fault Testing for VLSI Circuits (Frontiers in Electronic Testing)

by Angela Krstic,Kwang-Ting (Tim) Cheng


ISBN 13: 9780792382959

Format: Hardcover (208 pages)
Publisher: Springer
Published: 31 Oct 1998

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Dry Etching for VLSI (Updates in Applied Physics and Electrical Technology) Dry Etching for VLSI (Updates in Applied Physics and Electrical Technology) by A.J. van Roosmalen, J.A.G. Baggerman, S.J.H. Brader

Dry Etching for VLSI (Updates in Applied Physics and Electrical Technology)

by A.J. van Roosmalen, J.A.G. Baggerman, S.J.H. Brader


ISBN 13: 9780306438356

Format: Hardcover (237 pages)
Publisher: Springer
Published: 31 Mar 1991

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New : $171.09  
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Phase Change Materials: Science and Applications Phase Change Materials: Science and Applications by

Phase Change Materials: Science and Applications

by


ISBN 13: 9780387848730

Format: Hardcover (450 pages)
Publisher: Springer
Published: 23 Dec 2008

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Microsystem Design Microsystem Design by Stephen D. Senturia

Microsystem Design

by Stephen D. Senturia


ISBN 13: 9780792372462

Format: Hardcover (720 pages)
Publisher: Springer
Published: 29 Jul 2005

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New : $164.29  
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Embedded SoPC System with Altera NiosII Processor and VHDL Examples Embedded SoPC System with Altera NiosII Processor and VHDL Examples by Pong P. Chu

Embedded SoPC System with Altera NiosII Processor and VHDL Examples

by Pong P. Chu


ISBN 13: 9781118008881

Format: Hardcover (736 pages)
Publisher: Wiley-Blackwell
Published: 03 Oct 2011

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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections (Springer Series in Reliability Engineering) Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections (Springer Series in Reliability Engineering) by Cher Ming Tan, Wei Li, Zhenghao Gan, Yuejin Hou

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections (Springer Series in Reliability Engineering)

by Cher Ming Tan, Wei Li, Zhenghao Gan, Yuejin Hou


ISBN 13: 9780857293091

Format: Hardcover (157 pages)
Publisher: Springer
Published: 07 Mar 2011

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Extrusion in Ceramics: Engineering Materials and Processes Extrusion in Ceramics: Engineering Materials and Processes by

Extrusion in Ceramics: Engineering Materials and Processes

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ISBN 13: 9783540271000

Format: Hardcover (424 pages)
Publisher: Springer
Published: 22 Jun 2007

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The Stationary Semiconductor Device Equations (Computational Microelectronics) The Stationary Semiconductor Device Equations (Computational Microelectronics) by P.A. Markowich

The Stationary Semiconductor Device Equations (Computational Microelectronics)

by P.A. Markowich


ISBN 13: 9783211999370

Format: Paperback (202 pages)
Publisher: Springer
Published: 19 Oct 2010

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New : $111.75  
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