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Carbon Nanowalls: Synthesis and Emerging Applications

by Mineo Hiramatsu,Masaru Hori

ISBN 13: 9783211997178

Format: Hardcover (161 pages)
Publisher: Springer
Published: 31 Jul 2010

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Handbook of Power Systems I (Energy Systems)

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ISBN 13: 9783642024924

Format: Hardcover (500 pages)
Publisher: Springer
Published: 01 Sep 2010

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Probability, Statistics, and Random Processes for Electrical Engineering

by Alberto Leon-Garcia

ISBN 13: 9780131471221

Format: Hardcover (832 pages)
Publisher: Prentice Hall
Published: 28 Dec 2007

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Artificial Tactile Sensing in Biomedical Engineering (ELECTRONICS)

by Siamak Najarian,Javad Dargahi,Ali Abouei Mehrizi

ISBN 13: 9780071601511

Format: Illustrated (260 pages)
Publisher: McGraw-Hill Education
Published: 01 Jun 2009

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Protective Relaying of Power Systems Using Mathematical Morphology

by Q.H. Wu,Zhen Lu,Tianyao Ji

ISBN 13: 9781848824980

Format: Hardcover (232 pages)
Publisher: Springer
Published: 19 May 2009

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Und Brdbnd Over POW Line

by Gilbert Held

ISBN 13: 9780849398469

Format: Hardcover (200 pages)
Publisher: Auerbach Publications
Published: 17 May 2006

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Mul Sen Ime Fus and it Apps (Signal Processing and Communications)

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ISBN 13: 9780849334177

Format: Hardcover (528 pages)
Publisher: CRC Press
Published: 28 Jul 2005

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Tolerance Analysis of Electron Circuits Using Mathcad

by Robert Boyd

ISBN 13: 9780849323393

Format: Paperback (216 pages)
Publisher: CRC Press
Published: 24 Sep 1999

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Noise of Polyphase Electric Motors (Electrical and Computer Engineering)

by Jacek F. Gieras,Chong Wang,Joseph Cho Lai

ISBN 13: 9780824723811

Format: Hardcover (392 pages)
Publisher: CRC Press
Published: 12 Dec 2005

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Tribology of Elec Contacts (Electrical and Computer Engineering)

by Milenko Braunovic,Nikolai K. Myshkin,Valery V. Konchits

ISBN 13: 9781574447279

Format: Hardcover (672 pages)
Publisher: CRC Press
Published: 15 Dec 2006

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Power Definitions and the Physical Mechanism of Power Flow (Wiley - IEE)

by Alexander Eigeles Emanuel

ISBN 13: 9780470660744

Format: Hardcover (280 pages)
Publisher: Wiley-Blackwell
Published: 20 Aug 2010

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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging: Technology Drivers Pt. 1

by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein

ISBN 13: 9780412084317

Format: Hardcover (752 pages)
Publisher: Springer
Published: 31 Jan 1997

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