Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology)

Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology)

by Cher Ming Tan (Author), Cher Ming Tan (Author), Feifei He (Contributor)

Synopsis

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.

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More Information

Format: Paperback
Pages: 116
Edition: 2013
Publisher: Springer
Published: 04 May 2013

ISBN 10: 9814451207
ISBN 13: 9789814451208