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3D Microelectronic Packaging: From Architectures to Applications: 64 (Springer Series in Advanced Microelectronics, 64)

3D Microelectronic Packaging: From Architectures to Applications: 64 (Springer Series in Advanced Microelectronics, 64)

by Yan Li (Editor), Deepak Goyal (Editor)

$221.97

Quantity

20 in stock

More Information

Format: Hardcover
 Pages: 639
 Edition: 2nd ed. 2021
 Publisher: Springer
Published: 24 Nov 2020
ISBN 10: 9811570892
ISBN 13: 9789811570896