by Zhouping Yin (Author), YongAn Huang (Author), Xiaodong Wan (Author)
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Format: Hardcover
Pages: 308
Edition: 1st ed. 2019
Publisher: Springer
Published: 14 Jun 2019
ISBN 10: 9811336261
ISBN 13: 9789811336263
Xiaodong Wan received his B.S. and Ph.D. degrees in engineering mechanics from Huazhong University of Science and Technology (HUST), Wuhan, China, in 2012 and 2016, respectively. He is currently a Postdoctoral Fellow at the School of Mechanical Science and Engineering, HUST. His research interests include flexible electronics manufacturing and laser processing. Dr. Wan received the Young Scientists Fund of the National Natural Science Foundation of China.