Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales

by Jianfeng Luo (Author), David A. Dornfeld (Contributor)

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Paperback
2010
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Format: Paperback
Pages: 336
Edition: Softcover reprint of hardcover 1st ed. 2004
Publisher: Springer Berlin Heidelberg
Published: 19 Feb 2010
ISBN 10: 364206115X
ISBN 13: 9783642061158

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales

New

$171.48

$171.48

More Information