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Wafer Bonding: Applications and Technology: 75 (Springer Series in Materials Science)

Wafer Bonding: Applications and Technology: 75 (Springer Series in Materials Science)

by Marin Alexe (Editor), Marin Alexe (Editor), Ulrich G. Sele (Editor), Ulrich Gosele (Editor)

$309.51

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10 in stock

More Information

Format: Paperback
 Pages: 524
 Edition: Softcover reprint of the original 1st ed. 2004
 Publisher: Springer
Published: 30 Sep 2011
ISBN 10: 3642059155
ISBN 13: 9783642059155