Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method

by Sheng-JyeHwang (Author), Yeong-JyhLin (Author)

New
Paperback
2008
$59.72

$59.72

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10 in stock

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Format: Paperback
Pages: 136
Publisher: VDM Verlag Dr. Muller Aktiengesellschaft & Co. KG
Published: 22 Apr 2008
ISBN 10: 363900034X
ISBN 13: 9783639000344

Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method

New

$59.72

$59.72

More Information