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Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method

Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method

by Sheng-JyeHwang (Author), Yeong-JyhLin (Author)

$57.48

Quantity

10 in stock

More Information

Format: Paperback
 Pages: 136
 Publisher: VDM Verlag Dr. Muller Aktiengesellschaft & Co. KG
Published: 22 Apr 2008
ISBN 10: 363900034X
ISBN 13: 9783639000344