Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science)

Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science)

by M . R . Oliver (Editor)

Synopsis

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

$308.66

Quantity

20+ in stock

More Information

Format: Hardcover
Pages: 425
Publisher: Springer
Published: 26 Jan 2004

ISBN 10: 3540431810
ISBN 13: 9783540431817