Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales

by David Dornfeld (Author), David Dornfeld (Author), Jianfeng Luo (Author)

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Hardcover
2004
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Format: Hardcover
Pages: 311
Edition: 2004
Publisher: Springer
Published: 07 Oct 2004
ISBN 10: 354022369X
ISBN 13: 9783540223696

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales

New

$180.75

$180.75

More Information