by JamesE.Morris (Editor), James E. Morris (Editor)
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive inks, underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Format: Hardcover
Pages: 1026
Edition: 2nd ed. 2018
Publisher: Springer
Published: 02 Oct 2018
ISBN 10: 3319903616
ISBN 13: 9783319903613