3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)

by Deepak Goyal (Editor), Yan Li (Editor)

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Paperback
2018
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Format: Paperback
Pages: 476
Edition: Softcover reprint of the original 1st ed. 2017
Publisher: Springer
Published: 13 Jul 2018
ISBN 10: 3319830864
ISBN 13: 9783319830865

3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)

New

$192.03

$192.03

More Information