Testing of Interposer-Based 2.5D Integrated Circuits

by Krishnendu Chakrabarty (Author), Ran Wang (Author)

• New

  Hardcover
  2017

  $144.78

  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.