3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

by Gerhard Fettweis (Editor), Ibrahim(Abe)M.Elfadel (Editor)

New
Hardcover
2016
$67.11

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

Synopsis

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

$67.11

Save:$40.45 (38%)

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20 in stock

More Information

Format: Hardcover
Pages: 364
Edition: 1st ed. 2016
Publisher: Springer
Published: 23 May 2016
ISBN 10: 3319204807
ISBN 13: 9783319204802

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

New

$67.11

Synopsis

$67.11

More Information