Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

by EhrenfriedZschech (Editor), Caroline Whelan (Editor), ThomasMikolajick (Editor)

Synopsis

This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

$385.49

Quantity

20+ in stock

More Information

Format: Hardcover
Pages: 508
Edition: 1st Edition.
Publisher: Springer
Published: 01 Sep 2005

ISBN 10: 1852339411
ISBN 13: 9781852339418