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Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

by Caroline Whelan (Editor), EhrenfriedZschech (Editor), ThomasMikolajick (Editor)

$205.13

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10 in stock

More Information

Format: Paperback
 Pages: 532
 Edition: Softcover reprint of hardcover 1st ed. 2005
 Publisher: Springer
Published: 22 Oct 2010
ISBN 10: 1849969671
ISBN 13: 9781849969673