Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

by Yong Liu (Author), Shichun Qu (Author)

New
Illustrated
2014
$175.68

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

Synopsis

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

$175.68

Quantity

20+ in stock

More Information

Format: Illustrated
Pages: 342
Edition: 2015
Publisher: Springer
Published: 11 Sep 2014
ISBN 10: 149391555X
ISBN 13: 9781493915552

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

New

$175.68

Synopsis

$175.68

More Information