Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems)

by Lingling Xiong (Author), Wei Zhao (Author), Xingsheng Liu (Author)

New
Illustrated
2014
$217.22

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Synopsis

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

$217.22

Quantity

20+ in stock

More Information

Format: Illustrated
Pages: 420
Edition: 2015
Publisher: Springer
Published: 15 Jul 2014
ISBN 10: 1461492629
ISBN 13: 9781461492627