Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

by YongLiu (Author)

New
Hardcover
2012
$304.20

This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field.

Synopsis

This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field.

$304.20

Quantity

20+ in stock

More Information

Format: Hardcover
Pages: 591
Edition: 2012
Publisher: Springer
Published: 17 Feb 2012
ISBN 10: 1461410525
ISBN 13: 9781461410522

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

New

$304.20

Synopsis

$304.20

More Information