The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

by Gerard Kelly (Author)

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Paperback
2014
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Format: Paperback
Pages: 160
Edition: 1999
Publisher: Springer
Published: 30 Apr 2014
ISBN 10: 1461372763
ISBN 13: 9781461372769

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

New

$102.51

$102.51

More Information