Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms And Application To Ic Interconnect Technology

by Christopher Lyle Borst (Author), Ronald J. Gutmann (Contributor), William N. Gill (Contributor)

• New

  Paperback
  2014

  $158.45

  As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects.