RF and Microwave Microelectronics Packaging

by KenKuang (Editor), Franklin Kim (Editor), SeanS.Cahill (Editor)

New
Hardcover
2009
$204.70

This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.

Synopsis

This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.

$204.70

Quantity

20+ in stock

More Information

Format: Hardcover
Pages: 285
Publisher: Springer
Published: 18 Nov 2009
ISBN 10: 1441909834
ISBN 13: 9781441909831

RF and Microwave Microelectronics Packaging

New

$204.70

Synopsis

$204.70

More Information