Three Dimensional System Integration: IC Stacking Process and Design

by Dimitrios Soudris (Editor), Antonis Papanikolaou (Editor), RikoRadojcic (Editor)

New
Hardcover
2010
$130.58

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life.

Synopsis

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life.

$130.58

Quantity

20+ in stock

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Format: Hardcover
Pages: 254
Edition: 1st Edition.
Publisher: Springer
Published: 16 Dec 2010
ISBN 10: 1441909613
ISBN 13: 9781441909619

Three Dimensional System Integration: IC Stacking Process and Design

New

$130.58

Synopsis

$130.58

More Information