Introduction to Microsystem Packaging Technology

by YufengJin (Author), ZhipingWang (Author), JingChen (Author)

New
Hardcover
2010
$169.86

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.

Synopsis

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.

$169.86

Quantity

5 in stock

More Information

Format: Hardcover
Pages: 232
Edition: 1
Publisher: CRC Press
Published: 08 Oct 2010
ISBN 10: 1439819106
ISBN 13: 9781439819104

Introduction to Microsystem Packaging Technology

New

$169.86

Synopsis

$169.86

More Information