Nanoparticle Engineering for Chemical-mechanical Planarization

by UngyuPaik (Author), Jea-GunPark (Author)

• New

  Hardcover
  2009

  $209.33

  Explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP and noble metal CMP. This work also presents design techniques using polymeric additives to improve CMP performance.