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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Wiley - IEEE)

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Wiley - IEEE)

by Tzyy-Sheng Jason Horng (Author), Lih-Tyng Hwang (Author)

  • New

    Hardcover 2018

    $140.12
Synopsis

Advanced Stacking and Planar Solutions for 5G Mobility. An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

$140.12

Quantity

11 in stock

More Information

Format: Hardcover
 Pages: 464
 Edition: 1
 Publisher: Wiley-IEEE Press
Published: 19 Jun 2018
ISBN 10: 1119289645
ISBN 13: 9781119289647