3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Wiley - IEEE)

by Tzyy-Sheng Jason Horng (Author), Lih-Tyng Hwang (Author)

New
Hardcover
2018
$138.89

Advanced Stacking and Planar Solutions for 5G Mobility. An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

Synopsis

Advanced Stacking and Planar Solutions for 5G Mobility. An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

$138.89

Quantity

11 in stock

More Information

Format: Hardcover
Pages: 464
Edition: 1
Publisher: Wiley-IEEE Press
Published: 19 Jun 2018
ISBN 10: 1119289645
ISBN 13: 9781119289647

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Wiley - IEEE)

New

$138.89

Synopsis

$138.89

More Information