by Fred D . Barlow I I I (Editor), Aicha Elshabini (Editor)
Offers coverage of various aspects of ceramic interconnect technologies in electronics and electronic packaging. This book discusses trends in electronic packaging, electrical design, simulation, and testing, ceramic materials, and the various types of ceramic interconnects, devices, and applications.
Format: Hardcover
Pages: 456
Publisher: CRC Press
Published: 24 Jan 2007
ISBN 10: 0849335574
ISBN 13: 9780849335570
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