Hybrid Assemblies and Multichip Modules: 38 (Manufacturing Engineering and Materials Processing)

Hybrid Assemblies and Multichip Modules: 38 (Manufacturing Engineering and Materials Processing)

by Kear (Author)

Synopsis

Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

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More Information

Format: Illustrated
Pages: 296
Edition: 1
Publisher: CRC Press
Published: 16 Dec 1992

ISBN 10: 0824784669
ISBN 13: 9780824784669