by HalehArdebiliDr. (Author), Michael Pecht (Author)
Offers a comprehensive discussion of encapsulants in electronic applications. This work emphasizes on the encapsulation of microelectronic devices. It discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants.
Format: Hardcover
Pages: 504
Publisher: William Andrew
Published: 13 Apr 2009
ISBN 10: 0815515766
ISBN 13: 9780815515760