Encapsulants for Electronic Applications (Materials and Processes for Electronic Applications)

Encapsulants for Electronic Applications (Materials and Processes for Electronic Applications)

by HalehArdebiliDr. (Author), Michael Pecht (Author)

Synopsis

Offers a comprehensive discussion of encapsulants in electronic applications. This work emphasizes on the encapsulation of microelectronic devices. It discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants.

$158.89

Quantity

20+ in stock

More Information

Format: Hardcover
Pages: 504
Publisher: William Andrew
Published: 13 Apr 2009

ISBN 10: 0815515766
ISBN 13: 9780815515760