Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

by YongLiu (Author), ShengLiu (Author)

• New

  Hardcover
  2011

  $175.91

  An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.