by TetsuyaOsaka (Editor), Madhav Datta (Editor), YosiShacham-Diamand (Editor), TakayukiOhba (Editor)
Electromechanical processes for Ultra-large-Scale Integration technology for Integrated Circuits applications is a new frontier in electrochemistry and science. This book details copper based interconnect technology for ULSI technology to ICs application.
Format: Hardcover
Pages: 552
Publisher: Springer
Published: 16 Oct 2009
ISBN 10: 0387958673
ISBN 13: 9780387958675
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