by Andrew E . Perkins (Author), SureshK.Sitaraman (Author)
Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.
Format: Hardcover
Pages: 192
Edition: illustrated edition
Publisher: Springer
Published: 28 Nov 2008
ISBN 10: 0387793933
ISBN 13: 9780387793931
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