Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

by Chuan Seng Tan (Editor), RonaldJ.Gutmann (Editor), L.RafaelReif (Editor)

• New

  Hardcover
  2008

  $261.42

  This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.