Integrated Circuit Packaging, Assembly and Interconnections: Trends and Options (Springer Series in Advanced Microelectronics)

by WilliamGreig (Author)

• New

  Hardcover
  2007

  $175.28

  Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.