by Banqiu Wu (Author), Kumar (Author), SeshRamaswami (Author)
The latest advances in three-dimensional integrated circuit stacking technology
Format: Hardcover
Pages: 544
Edition: 1
Publisher: McGraw-Hill Professional
Published: 12 Sep 2011
ISBN 10: 007174195X
ISBN 13: 9780071741958
FREE UK DELIVERY 
Global shipping from £2.99
FREE UK DELIVERY
30 Day Refund Guarantee
