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Failure-Free Integrated Circuit Packages: Systematic Elimination of Failures (McGraw-Hill Professional Engineering)

Failure-Free Integrated Circuit Packages: Systematic Elimination of Failures (McGraw-Hill Professional Engineering)

by Charles Harper (Author), Charles Harper (Author), Charles Cohn (Author)

  • New

    Hardcover 2004

    $125.31
Synopsis

Spot, stop, and analyze IC device failure with this unique illustrated guide. Worth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques. Failure-Free Integrated Circuit Packages helps you: find, identify, and correct potential failures before they occur; improve device reliability; learn from case studies of IC package failure modes; quickly locate failures through visual comparisons; apply state-of-the-art failure analysis techniques; comprehend the physics behind the failure mechanism; and, understand the limitations of reliability testing and lifetime estimation.Inside, you'll find a practical and easy way to approach failure analysis of IC's in organic packages. Areas covered include: fundamentals of IC package technologies; reliability; physics and chemistry of failures in packaged devices; strategies for locating failures; failure analysis techniques; failure modes common in organic IC packages; and, emerging assembly materials for IC packaging.

$125.31

Quantity

20+ in stock

More Information

Format: Hardcover
 Pages: 366
 Publisher: McGraw-Hill Education
Published: 01 Sep 2004
ISBN 10: 0071434844
ISBN 13: 9780071434843

Media Reviews
Failure-Free Integrated Circuit Packages is a new book in Charles Harper's Electronic Packaging and Interconnection Series. The subtitle explains further what this book is focusing on, namely the systematic elimination of failures through reliability engineering, failure analysis, and material improvements. The publication makes ample us of illustrations and has the depth and breadth to become a useful quality guide for manufacturers and users of integrated circuit packages. The co-editors Charles Cohn (Agere Systems) and Charles Harper (Technology Seminars, Inc.) have assembled a knowledgeable group of authors, all employees of Agere Systems, many of them bringing a wealth of insight based on their experience with AT&T and Lucent Technologies, the grandparents and parents of Agere Systems. While some might be critical of this book in that it reflects the practices of only one company, the fact is that the book comes from the organization that literately wrote the books on quality and reliability that established the high standards in the electronic industry that we have today. The authors of the chapters in this edited book have in-depth, long experience in their individual subjects creating an excellent reference book. Reliability of advanced IC packages is a hot topic more so than ever. The use of brittle low Dk dielectric in the redistribution layers of the IC makes these chips more prone to cracking than ICs with all SiO2 dielectric layers. Better CTE (coefficient of thermal expansion) match of all package layers to the low CTE of the IC becomes important, as does the use of buffer or compliant layers. The very fine pitch and tight via spacing on build-up dielectric microvia layers makes these packages more susceptible to CAF (conductive anodic filament) formation. Furthermore, no-lead solders require higher reflow temperatures and thermal management has become critical as thermal densities of ICs approach 100 W/cm2. The book is structured into eight chapters: an introduction and overview, fundamentals of IC package technologies, reliability, physics and chemistry of failures in packaged devices, strategies for locating failures, failure analysis techniques, failure modes common in organic IC packages, and emerging assembly materials for IC packaging. The chapters on strategies for locating failures, failure analysis techniques, and examples of failure modes common in organic IC packages make up the bulk of the book. The Strategies for Locating Failures chapter contains three useful case studies that employ finite element modeling and design of experiments to probe root causes of failures. The Melissa E. Grupen-Shemansky's Introduction provides a good overview and roadmap to the chapters in the book. It provides important background for the reader to understand the changes in the industry structure and the issues in insuring a high level of quality and reliability in what has become a complex supply chain. Charles Cohn's chapter on the Fundamentals of IC Package Technologies is well done and, while there are some minor historical inaccuracies, provides excellent background on mature as well as emerging technologies useful to both the novice and those experienced in the field. Charles does not assume that the reader is familiar with the alphabet soup of package names, and he carefully explains acronyms when they first appear. The author has subdivided the technologies into four generic types comparing attributes and tradeoffs, physical properties and rankings. ... the chapter is a very good overall summary of packaging technology. Jason P. Goodelle's and John W. Osenbach's chapter on Emerging Assembly Materials for IC Packaging give useful insight in the relationship between chemical structures and chemical and mechanical properties of materials as they impact package reliability. ... The failure analysis chapters are profusely illustrated with charts, graphs and photographs for easy understanding of defects and failure modes. A very effective case study approach is used to lead one through the various steps from problem recognition to fault location to cause and solution. Guideline charts and protocols or strategies for analysis are detailed. The examples of test vehicles for reliability testing and case study examples are most useful for they address issues with large I/O new and advanced package types. ... This book is one that should be a primary reference for anyone involved in IC packaging, Reliability or Quality engineering. CircuiTree Magazine 20050101 Integrated circuit packages are unquestionably the heart of modern electronic assemblies. With the ever-increasing functional density and complexity of these advanced electronic packages, the need to find, identify, and correct potential failures before they occur becomes more and more critical. And the multiple locations, even internationally, required for the complete cycle of design, manufacture, and use of these packages often further complicate the problems of achieving failure-free integrated circuit assemblies. Hence, since integrated circuit packages are so widely used, in their various forms, this just-released new book will be invaluable for the book shelves of most readers of this review. Entirely written by the staff of experienced specialists at Agere Systems (formerly Lucent and AT&T), this book is loaded with practical, real world, illustrations and examples. It could, in fact, well serve as an in-plant guidebook for quality control, failure analysis, and accept-reject criterion. The book is divided into eight well-organized and clearly presented chapters, including descriptions of the various IC packaging technologies, understanding of all of the device reliability factors, physics and chemistry of failures in packaged devices, strategies for locating failures, all of the many failure analysis techniques, clear presentations of all of the many common failure modes, a wide range of examples and case histories, and excellent discussions of the new IC packaging materials, including lead-free solders. This book should be invaluable for most book shelves, and also as an in-plant guidebook for quality and reliability operations. IMAPS (International Microelectronics and Packaging Society) Electronic Bulletin 20041109 ...easy to tell that this is one of the most useful books in the field of IC packaging reliability to come along in some time...If the IDMs and packaging foundries would pass this book out to new engineering hires, it might prevent some of those arduous, litigation-infested dramas that occur as customer and buyer try to plant the blame on each other for packaged ICs that fail in the field, seemingly without reason. ...there is a lot of solid meat-and-potatoes content and very little puffery...topics are fairly all-encompassing and include by chapter title, Fundamentals of IC Package Technolgoy, Device Reliability and Physics and Chemistry of Failures in Packaged Devices. Chapter 5, Strategies for Locating Failures by itself would be worth the modest price of admission. Chip Scale Review 20040901
Author Bio
Charles Cohn is a distinguished member of the technical staff at Agere Systems, Allentown, Pennsylvania, where he is the lead resource on PCB technology, supporting the development of advanced organic PBGA substrates for wire bonded and flip chip IC interconnections. He has authored chapters in several McGraw-Hill electronic packaging handbooks and presented numerous papers on electronic packaging. He has been awarded 11 U.S. patents on IC packaging. Mr. Cohn holds B.S., M.S., and M.E. degrees in mechanical engineering from Columbia University.

Charles A. Harper is president of Technology Seminars, Inc., Lutherville, Maryland, an organization dedicated to the presentation of educational seminars on electronic packaging and materials. He has authored over a dozen well-known books in the field and is among the founders and past presidents of the International Microelectronics Electronic and Packaging Society. He is also series editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he also served as adjunct professor.

Joze E. Antol - Member of Technical Staff in the Packaging and Interconnect Technology Dept. at Agere Systems, Allentown, PA. She has worked at AT&T Bell Labs / Lucent Technologies / Agere Systems for 20 years. Her current assignment focuses on the effects of probe and packaging on advanced IC technologies, such as 130nm copper / Low K. Previous assignments at AT&T / Lucent included die/wire bond process engineer in manufacturing and laboratory analyst responsible for ICP emission spectroscopy. She holds an AS degree in Chemical Engineering from Pennsylvania State University.

Frank A. Baiocchi - Distinguished Member of Technical Staff at Agere Systems, Allentown, PA. Dr. Baiocchi has been with AT&T / Lucent Technologies / Agere Systems for 21 years and is currently an analyst in the Product Analysis Laboratory involved in failure site analysis on a wide variety of analog and digital technologies. He has had responsibility for plasma etch process development in support of a CMOS manufacturing line and developed an LDMOS wafer fabrication process for an RF power transistor product. His experience includes materials characterization for silicon and III-V based semiconductor devices, plasma process engineering and silicon process technology. He has published more than 40 technical articles on analysis of thin film materials using accelerator based techniques such as Rutherford Backscattering. Dr. Baiocchi holds a BS degree in Chemistry from DePaul University and a PhD degree in Physical Chemistry from Harvard University.

Anthony J. Bucha - Senior Member of Technical Staff at Agere Systems, Allentown, PA. Mr. Bucha has been with Western Electric / AT&T Technologies / Lucent Technologies/ and Agere Systems for 24 years and is currently a Senior Analyst in the Product Analysis Lab. His responsibilities include product analysis for the reliability, qualification and yield improvement programs as well as administration of the labs safety program, and ISO 9001/2000 standards and documentation implementation. Previous work included opto-electronic device analysis, wafer yield improvement, and process characterization. He has written and co-authored several papers on product analysis and deprocessing techniques, some which were presented at various conferences including the International Symposium for Testing and Failure Analysis. Mr. Bucha was an active member of SEMATECH/International and the International Symposium for Testing and Failure Analysis Society.

James T. Cargo - Technical Manager at Agere Systems, Allentown, PA. Mr. Cargo has been with AT&T Bell Labs / Lucent Technologies / Agere Systems for 19 years. He started his career in AT&T Bell Lab's Integrated Circuits Technology R&D Laboratory. Over the years he has worked in several capacities including: ultra trace analytical chemistry, co-founding AT&T Analytical Services, Focused Ion Beam work and Failure Analysis, as they pertain to integrated circuits, optoelectronic components and MEMS devices. He has been actively involved in the Sematech Product Analysis Forum (PAF) and Sematech Assembly Analysis Forum (AAF). In addition, he has authored or coauthored more than 30 research papers and has 3 patents. Currently, Mr. Cargo manages Agere System's Product Analysis Lab, which is responsible for integrated circuit/package analysis associated with customer returns, engineering studies, qualification, reliability, yield improvement, design modifications, and latch-up evaluation. Mr. Cargo holds a BS degree in Chemistry from Syracuse University, a MS degree in Chemistry and a MBA from Lehigh University

John M. DeLucca - Member of Technical Staff at Agere Systems, Allentown, PA. Dr. DeLucca has been with Lucent Technologies / Agere Systems for four years and is currently a product and failure analyst in the Product Analysis Laboratory. He is the lead resource for transmission electron microscopy issues supporting customer returns, developmental work, and intellectual property-related issues. Prior to joining the product analysis group, Dr. DeLucca worked in several capacities including Supply Line Management, Reliability and Qualification, and more recently, Customer Technical Support for optoelectronic products. Dr. DeLucca graduated in 2000 with a PhD in Materials Engineering from the Pennsylvania State University from which he also holds an MS degree in Materials. He received a BSE in Materials Science and Engineering from the University of Pennsylvania in 1994. He has written and presented several papers on processing and characterization of wide band gap semiconductors and was awarded a Materials Research Society Graduate Student award in 1998.

Barry J. Dutt - Distinguished Member of Technical Staff at Agere Systems, Allentown, PA. Mr. Dutt has been with AT&T Bell Labs / Lucent Technologies / Agere Systems for 23 years. For the past 14 years he has worked in failure analysis and is currently a senior analyst in the Product Analysis Laboratory. He routinely performs product analysis on qualification, reliability, and manufacturing failures as well as customer returns and engineering evaluations related to design and process development. Previous analysis activities have also included opto-electronic and MEM's devices. While at Bell Laboratories, he was a member of the Digital Signal Processor design team, working in the areas of circuit simulation debug and circuit design. He has co-authored several papers, and presented at the International Symposium for Testing and Failure Analysis.

Jason P. Goodelle - Distinguished Member of Technical Staff at Agere Systems, Allentown, PA in the Packaging and Interconnect Technology Dept. In his 6 years with Agere Systems, he has been responsible for developing several advanced package assembly solutions (including flip chip and multi chip modules) both internally and through cooperative development efforts at various subcontractors. Dr. Goodelle obtained a BS in physics from Allegheny College and a PhD in Materials Science and Engineering from Lehigh University, specializing in mechanical and physical properties of bulk and thin film polymers. Dr. Goodelle has authored or co-authored several papers in the area of packaging solutions and materials for IC packaging.

Kultaransingh N. Hooghan - Senior Member of Technical Staff at Agere Systems, Allentown, PA. Mr. Hooghan has been with Lucent Technologies/Agere Systems for 7 years as a Failure Analyst in the Product Analysis Dept. His primary responsibility is carrying out Physical Failure Analyses using a Focused Ion Beam (FIB) system. He has three US patents pending on processes for FIB systems. Mr. Hooghan published numerous papers and authored a chapter in a book titled Introduction to Focused Ion Beams: Instrumentation, Theory, Techniques, and Practice . He also presented seminars related to FIB Systems. He holds a Masters Degree in Physics from the Bombay University, India and a Masters Degree in Engineering Technology from the University of North Texas.

John W. Osenbach - Consulting Member of Technical Staff at Agere Systems, Allentown, PA. Dr. Osenbach has been with AT&T Bell Labs/Lucent Technologies/Agere Systems for 22 years. The first half was spent in the development and reliability of silicon technology processes and materials, primarily dielectrics and metals for application on high voltage, high speed, CMOS devices. The next 10 years were devoted to metals, dielectrics, and package development for single mode laser based products. He helped develop a device and package technology that provided for the first time a reliable non-hermetic single mode laser and photodiode package technology. Currently, Dr. Osenbach is focused on package technology development for silicon integrated circuits. He has authored and co-authored more than 70 papers and was awarded 33 US patents. He organized and chaired a number of conferences on silicon technology and optoelectronic packaging, and taught conference courses on reliability of optoelectronic devices. He is a past associate editor of the Journal of Electrochemical Society. In 1999 he was made a Bell Laboratories Fellow for his work on the development of materials and processes needed for the manufacture of reliable non-hermetic opto-electronic and SIC packages. He holds a BS, MS and PhD in Ceramic Science and Engineering from Pennsylvania State University.

Albert C. Seier - Member of Technical Staff at Agere Systems, Allentown, PA. Mr. Seier has been with Lucent/Agere for six years and is currently a product analyst focusing on Agere worldwide electrical failure analysis needs with emphasis on electrical hardware . In addition, he interfaces with quality managers and lab analysts to ensure timely closure on customer returns. Managing laboratory case data entry is also among his responsibilities. Prior to joining Agere, Mr. Seier worked in research and development of electrical connectors for Thomas and Betts Corp. where he sat on the ANSI C119.4 standards committee. He co-authored a paper for IPFA2003 entitled Overview of Cu/low K Technology Failure Analysis and Reliability Issues . Mr. Seier holds a BSEE from Lafayette College.

Brian A. Sensenig - Senior Manager, Agere Systems Singapore Pte, Ltd, Singapore. Mr. Sensenig has been with Lucent Technologies / Agere Systems for 5 years and is currently a Senior Manager in the Global Procurement Organization headquartered in Singapore. He is responsible for the External Contract Manufacturing Assembly and Test services for Agere. Prior relocating to Singapore in September 2003, Mr. Sensenig worked in Agere's headquarters in Allentown, PA as the lead procurement resource providing purchasing counsel and support to Agere's Packaging & Interconnect Team for new package technologies. He maintains close relationships with a broad spectrum of organic and SATS suppliers world wide to continually assess their latest technologies and manufacturing capabilities. Mr. Sensenig holds a MBA from DeSales University and is an Approved Purchasing Practitioner (A.P.P.) and Certified Purchasing Manager (C.P.M.) from the Institute for Supply Management (ISM).

Joseph W. Serpiello - Distinguished Member of Technical Staff at Agere Systems, Allentown, PA. Mr. Serpiello has been affiliated with Bell Labs, AT&T Microelectronics, Lucent Technologies, and Agere Systems over the past 33 years, including 3 years with Solid State Scientific as a Senior Design Engineer in the Memory Products Group involved in high performance CMOS SRAM design. For the past 18 years he has worked in failure analysis and is currently a Senior Analyst in the Product Analysis Laboratory at Agere. He routinely performs failure analysis on qualification, reliability, and manufacturing failures as well as customer returns and engineering evaluations related to design and process development. While at Bell Labs, he was a member of the Logic and Memory Devices Group, involved in the areas of automated testing, parameter extraction, device modeling, alpha-radiation measurements of materials, circuit simulation and SRAM design. He was a former member of the SEMATECH Product Analysis Forum (PAF) and has co-authored several papers that were presented at the International Symposium for Testing and Failure Analysis (ISTFA) and the International Reliability Physics Symposium (IRPS). Mr. Serpiello holds degrees in electrical engineering from Temple University and Lafayette College (BSEE).

Melissa E. Grupen-Shemansky - Director of Packaging and Interconnection Technology Dept. at Agere Systems, Allentown, PA. Dr. Grupen-Shemansky has been with Agere Systems for 5 years managing high volume process technology development teams at the Agere factories in Thailand and Singapore, design teams in five locations worldwide, and a core packaging and interconnect technology team in the United States. Prior to joining Agere she had been with Motorola for 10 years in the Semiconductor Products Sector R&D labs and Manufacturing. Dr. Grupen-Shemansky's research responsibilities involved the development of selective polycrystalline silicon CVD techniques, GaAs RIE, wafer thinning, and wafer bonding. In 1992, she became a fab section manager within the Compound Semiconductor-1 GaAs device manufacturing line. Subsequently, her technical interests shifted to the development of IC and MEMS packaging, which called for collaborations with Motorola-Europe and Asia. Dr. Grupen-Shemansky received combined BS and MS degrees in Chemical Engineering from the Pennsylvania State University and her PhD from Arizona State University. Her academic research activities were interdisciplinary combining biomedical, electrical, and chemical engineering skills. She received various technical awards throughout her career, has been issued seven US patents, and has over 30 publications in several technical fields.

Richard L. Shook - Consulting Member of Technical Staff at Agere Systems, Allentown, PA, in the Packaging and Interconnect Technology Dept. Dr. Shook has been with AT&T Bell Labs / Lucent Technologies / Agere Systems for 20 years where his responsibilities include IC package development and reliability assessment, as well as moisture/reflow sensitivity issues. Recent research activities involved Pb-free assembly effects associated with package body warpage and Sn-whisker growth. He has contributed to the US industry standardization of moisture/reflow testing, through active participation on JEDEC and IPC committees. Some of Dr. Shook's technical contributions have been the development of the accelerated 60 DegreesC/60%RH test criteria incorporated in the joint IPC/JEDEC moisture sensitivity specification J-STD-020, and the development of moisture derating and baking procedures adopted in the joint handling specification J-STD-033. He has published extensively on the topic of moisture/reflow sensitivity and has received an outstanding paper award at the 1999 ECTC conference. He also received JEDEC and IPC technical recognition awards for his work on this topic. Dr. Shook has a PhD in Metallurgical Engineering from the Ohio State University.

Ronald J. Weachock - Senior Member of Technical Staff in the Product Realization Department at Agere Systems, Allentown, Pa. Mr. Weachock has been with Western Electric / AT&T Bell Labs / Lucent Technologies / Agere Systems for 20 years. He has worked extensively as a Failure Analysis Engineer for Qualification and Reliability of application specific integrated circuits (ASICs). He is currently involved in semiconductor root cause failure analysis in the field of advanced packaging and interconnect technologies, including standard packages, ball grid arrays (BGAs), advanced single-chip thermally enhanced packaging, and multi-chip modules (MCM). He specializes in defect analysis of high pin count flip chip package/interconnects and defect analysis for reliability assessment of advanced electronic package interconnects systems for new product. He has co-authored Assessment of Flip Chip Interconnect Integrity using Scanning Acoustic Microscopy and contributed to several technical papers in the area of electronic-packaging-stress-related-issues. He received his BSEET from Pennsylvania State University.

Huixian Wu - Member of Technical Staff at Agere Systems, Allentown, PA. Ms. Wu has been with Agere Systems for four years, working on advanced FA development and integrated circuit/package product analysis associated with technology development, customer returns, qualification, reliability, yield improvement, and design modifications. Ms. Wu received her BS degree both in Material Science & Engineering, and Computer Science & Engineering with highest honor in 1996, and M.S. degree in Semiconductor Materials in 1998 from the Zhejiang University in China and another MS degree in Reliability Engineering from the University of Maryland in 2000. She is a now PhD candidate in the Dept. of Electrical and Computer Engineering at Lehigh University. Ms. Wu has authored or coauthored 18 research papers.

Weidong Xie - Senior Member of Technical Staff at Agere Systems, Allentown, PA. in the Packaging and Interconnection Technology Dept. Dr Xie joined Agere in 2001 and has been involved in new packaging technology developments with emphasis in finite element analysis, thermo-mechanical modeling, interfacial delamination, solder joint fatigue, and packaging reliability qualification. He has over nine years experience in structural durability and damage tolerance evaluation and experiment. Dr. Xie holds a Bachelor's Degree in engineering from the Harbin Shipbuilding Engineering Institute, Harbin, China and a Master's Degree in Solids Mechanics from the Northwestern Polytechnic University, Xian, China. He also holds a MS in Aerospace Engineering and a PhD in Mechanical Engineering from Georgia Institute of Technology.