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Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method by Sheng-Jye Hwang,Yeong-Jyh Lin

Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method

by Sheng-Jye Hwang,Yeong-Jyh Lin


ISBN 13: 9783639000344

Format: Paperback (136 pages)
Publisher: VDM Verlag Dr. Muller Aktiengesellschaft & Co. KG
Published: 22 Apr 2008

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