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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Wiley - IEEE) 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Wiley - IEEE) by Lih-Tyng Hwang,Tzyy-Sheng Jason Horng

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (Wiley - IEEE)

by Lih-Tyng Hwang,Tzyy-Sheng Jason Horng


ISBN 13: 9781119289647

Format: Hardcover (464 pages)
Publisher: Wiley-IEEE Press
Published: 19 Jun 2018

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