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Encapsulants for Electronic Applications (Materials and Processes for Electronic Applications) Encapsulants for Electronic Applications (Materials and Processes for Electronic Applications) by Haleh Ardebili Dr., Michael Pecht

Encapsulants for Electronic Applications (Materials and Processes for Electronic Applications)

by Haleh Ardebili Dr., Michael Pecht


ISBN 13: 9780815515760

Format: Hardcover (504 pages)
Publisher: William Andrew
Published: 13 Apr 2009

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Reliability Engineering: 86 (Wiley Series in Systems Engineering and Management) Reliability Engineering: 86 (Wiley Series in Systems Engineering and Management) by Kailash C. Kapur,Michael Pecht

Reliability Engineering: 86 (Wiley Series in Systems Engineering and Management)

by Kailash C. Kapur,Michael Pecht


ISBN 13: 9781118140673

Format: Hardcover (512 pages)
Publisher: Wiley
Published: 30 May 2014

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Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging) Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging) by Michael Pecht

Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)

by Michael Pecht


ISBN 13: 9780367400064

Format: Paperback (224 pages)
Publisher: Routledge
Published: 07 Oct 2019

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The Chinese Electronics Industry (Electronics Industry Research Series) The Chinese Electronics Industry (Electronics Industry Research Series) by Michael Pecht

The Chinese Electronics Industry (Electronics Industry Research Series)

by Michael Pecht


ISBN 13: 9780849331749

Format: Paperback (192 pages)
Publisher: Routledge
Published: 20 May 1999

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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging) Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging) by Pradeep Lall, Michael G. Pecht, Edward B. Hakim

Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)

by Pradeep Lall, Michael G. Pecht, Edward B. Hakim


ISBN 13: 9780849394508

Format: Hardcover (336 pages)
Publisher: CRC Press
Published: 24 Apr 1997

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Advanced Routing of Electronic Modules: 2 (Electronic Packaging) Advanced Routing of Electronic Modules: 2 (Electronic Packaging) by Michael Pecht, Yeun Tsun Wong

Advanced Routing of Electronic Modules: 2 (Electronic Packaging)

by Michael Pecht, Yeun Tsun Wong


ISBN 13: 9780849396229

Format: Hardcover (480 pages)
Publisher: CRC Press
Published: 23 Oct 1995

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