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Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications) Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications) by Jiawei Zhang, Haleh Ardebili Dr., Michael Pecht, James J. Licari

Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)

by Jiawei Zhang, Haleh Ardebili Dr., Michael Pecht, James J. Licari


ISBN 13: 9780128119785

Format: Paperback (550 pages)
Publisher: William Andrew
Published: 01 Oct 2018

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New : $177.95  
New : $177.95